Datasheet

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HTCA

Heat Transfer Compound - Aerosol

HTCA offers a way of applying a thin, even film of HTC and is especially useful for applications over larger

areas. HTCA is recommended where the efficient and reliable thermal coupling of electronic components or

heat dissipation between any surfaces are required. HTCA is a non-silicone paste, suitable for applications

where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.

 Aerosol product; ideal for application over larger areas

 Based on a non-silicone oil; avoids issues with silicone and LMW siloxane migration

 Good thermal conductivity; designed for use as a thermal interface material

 Non-curing paste; allows simple and efficient rework of components if required

Approvals RoHS-2 Compliant (2011/65/EU): Yes

Typical Properties Colour: White

Base: Blend of synthetic fluids

Thermo-conductive Component: Powdered metal oxides

Thermal Conductivity (Guarded Hot Plate): 0.9 W/m•K

Thermal Conductivity (Heat Flow): 0.7 W/m•K (calculated)

Density @ 20°C (g/ml): 2.04

Temperature Range: -50°C to +130°C

Weight Loss after 96 hours @ 100°C: <1.0%

Permittivity @ 106Hz: 4.2

Volume Resistivity: 1 x 10

Ohms-cm

Dielectric Strength: 42 kV/mm

Cone Penetration @ 20°C: 300

Description Packing Order Code Shelf Life

Heat Transfer Compound – Aerosol 200ml Aerosol HTCA200 48 months

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Page 1 HTCA Heat Transfer Compound - Aerosol HTCA offers a way of applying a thin, even film of HTC and is especially useful for applications over larger areas. HTCA is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTCA is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
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Page 2 Directions for Use Thermal pastes can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces.