Datasheet

Page 1

HTC

Heat Transfer Compound

HTC is a non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended

where the efficient and reliable thermal coupling of electronic components or heat dissipation between any

surfaces are required. HTC is a non-silicone paste, suitable for applications where silicones are prohibited, thus

avoiding issues with silicone and low molecular weight siloxane migration.

· General purpose thermal management paste; cost effective heat dissipation

· Based on a non-silicone oil; avoids issues with silicone and LMW siloxane migration

· Good thermal conductivity; designed for use as a thermal interface material

· Non-curing paste; allows simple and efficient rework of components if required

Approvals RoHS Compliant (2015/863/EU): Yes

NATO Stock No. – EHTC10S: 6850-99-775-5881

NATO Stock No. – EHTC20S: 5835-99-775-5881

NATO Stock No. – EHTC35S: 5975-99-512-1473

Typical Properties Colour: White

Base: Blend of synthetic fluids

Thermo-conductive Component: Powdered metal oxides

Density @ 20°C (g/ml): 2.04

Cone Penetration @ 20°C: 300

Viscosity @ 1rpm (Pa s): 202-205

Thermal Conductivity (Guarded Hot Plate): 0.9 W/m.K

Thermal Conductivity (Heat Flow): 0.7 W/m.K (calculated)

Temperature Range: -50°C to +130°C

Weight Loss after 96 hours @ 100°C: <1.0%

Permittivity @ 1 GHz: 4.2

Volume Resistivity: 1 x 10

Ohms-cm

Dielectric Strength: 42 kV/mm

Description Packing Order Code Shelf Life

2 ml Syringe HTC02S 48 months

Heat Transfer Compound 10 ml Syringe HTC10S 48 months

20 ml Syringe HTC20S 48 months

35 ml Luer Lock Syringe HTC35SL 48 months

100 ml Tube HTC100T 48 months

700 gram Cartridge HTC700G 72 months

1 Kg Bulk HTC01K 72 months

12.5kg Bulk HTC12.5K 72 months

25 Kg Bulk HTC25K 72 months

PAGE 1
Page 1 HTC Heat Transfer Compound HTC is a non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTC is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
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Page 2 Directions for Use Thermal pastes can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces.