Datasheet

ER2223
Epoxy Resin
ER2223 is a two-part filled, high Tg, low viscosity epoxy encapsulation resin which has primarily been developed
for encapsulation of electrical components that require high temperature resistance.
• Low viscosity; aids ease of potting difficult and complex geometries
• Good chemical resistance; offers good protection in a range of environments
• Excellent adhesion to a wide range of substrates
• Wide operating temperature range; excellent high temperature performance
Typical Properties
Liquid Properties:
Base Material Epoxy
Density Part A - Resin (g/ml) 1.15
Density Part B - Hardener (g/ml) 0.96
Part A Viscosity (mPa s @ 23ºC) 600-1000
Part B Viscosity (mPa s @ 23ºC) 50-100
Mixed System Viscosity (mPa s @ 23ºC) 150-250
Mix Ratio (Weight) 3.45 : 1
Mix Ratio (Volume) 2.90 : 1
Usable Life (20°C) 30 mins
Gel Time (23°C) 90 mins
Cure Time (23°C) 24 hours
Cure Time (60°C) 4 hours
Cure Time (100°C) 1 hour
Colour Part A - Resin Black
Colour Part B - Hardener Colourless to light brown
Storage Conditions Dry Conditions: Above 15°C, Below 35°C
Shelf Life 12 months
Shrinkage <1%



