Service Manual

MM-E 2072-09333-00
3-4
3-5. TROUBLESHOOTING
The purpose of the troubleshooting procedures is to return a defective Micom-Z unit to normal service
as soon as possible, by isolating the malfunction to a replaceable subassembly or module, and then
repairing the subassembly or module.
3-5.1 Overview of Troubleshooting Procedures
In case a malfunction is detected (either during field operation, or during testing), perform the
following steps in the order presented below, until the problem is isolated and corrected:
1. Refer to the troubleshooting instructions given in para. 3-7.2 of the Micom-Z Operator Manual,
which provides instructions for isolating the fault to a replaceable subassembly or module.
These instructions include preliminary troubleshooting, followed by the use of the BITE
function in accordance with para. 3-7.2 of the Micom-Z Operator Manual. After collecting the
error codes, refer to para. 3-5.2 for their interpretation.
2. If the problem is detected during testing, collect and analyze the results of the electrical test
procedures, and then refer to para. 3-5.4 for quick troubleshooting instructions. If the problem
cannot be corrected using the instructions in para. 3-5.4, refer to para. 3-5.5 for systematic
troubleshooting procedures.
Refer to para. 3-6 for Micom-Z disassembly, module replacement, and assembly procedures.
3. After identifying the defective subassembly or module, refer to para. 3-5.5 for module
troubleshooting instructions.
Remember that visual inspection may often detect faults without testing or making measurements.
Therefore, after opening the Micom-Z case, perform a thorough visual inspection and inspect its
wiring and module assemblies for physical damage. In particular, check for any external signs of
damaged components and/or damaged printed circuit boards. The possibility of intermittent faults
should not be overlooked. To reveal such defects, check the wiring, the coaxial cables, and the various
plugs and jacks of the modules. If the inspection reveals damage, replace the suspected part in
accordance with the applicable procedure of para. 3-6 before starting any other troubleshooting
procedures.
After completing the troubleshooting procedure and the associated repair tasks, repeat the full set of
performance checks listed in para. 3-4 to verify that the equipment has been returned to fully
operational condition.
NOTE
After replacing the LORD and/or the HI POWER module, it is
necessary to calibrate the RF transmit power using the RSS.
3-5.2 BIT Error Codes
Table 3-2 explains the meaning of the error codes generated by the BIT function, and lists their most
probable cause.
Table 3-2. BIT Error Codes
Error Code Meaning Probable Cause
00 O.K. – no errors
01 DSP boot checksum fail (during
download)
LORD board problem
02 DSP PLL unlock LORD board problem
03 DSP external RAM memory LORD board problem
04 Not applicable
05 DSP internal RAM memory LORD board problem