User`s guide

MaxLoader User’s Guide
122
file systems and simple algorithm with „skipping bad blocks‟. Please contact
support.eetools.com for further assistance.
10. GLOSSARY
BGA Ball Grid Array. A surface-mount device with solder balls and a high pin
count, similar to PGA.
Bipolar PROM A fuse-link programmable PROM.
Blank Check A test performed by a device programmer to ascertain whether a device has
been programmed (partial or total) or is in a virgin state.
Buffer Data storage unit directly stored on CPU.
Checksum A number that results by adding up every element of a pattern. Typically
either a four or eight digit HEX number, it is a quick way to identify a
pattern, since it is very unlikely that two patterns will have the same
checksum.
Compare Reading a programmable device and displaying any discrepancies from the
desired pattern. Each error is displayed on the screen. This comparison is
slower to perform than verify on the programmer.
Device Microchip or Integrated Circuit chip.
Die The silicon chip that is located within an IC package. It is a small rectangular
flat piece of silicon that has been fabricated with many transistors to
perform a specific function. It is glued into a plastic or ceramic package and
connected to the external metal interconnect pins of the IC with very small
bonding wires. It can be seen through the window of erasable EPROMs.
DIP Dual Inline Package. An IC package with two rows of through-hole pins,
usually on 0.1 pitch, 0.3 or 0.6 inches apart.
FPGA Field Programmable Gate Array. A very complex PLD. The FPGA usually
has an architecture that comprises a large number of simple logic blocks, a
number of input/output pads, and a method to make random connections
between the elements.
Functional Test A test that is performed following the programming of a PLD. The test
operates the device in its normal operating mode by simulating the inputs