User Manual

Red
pine Signals, Inc. Proprietary and confidential Page 11
RS9110
-
N
-
11
-
02
802.11bgn
WLAN
Module
Data Sheet
Version
1.48
2.4: R
ecommended Reflow Profile
Fi
gure
4: Reflow Profile
No
te: The profile shown is based on SAC 305 solder (3% silver, 0.5%
copper). We recommend the ALPHA OM-338 lead-free solder paste. This
profile is provided mainly for guidance. The total dwell time depends on the
thermal mass of the assembled board and the sensitivity of the components
on it.
2.5: Baking Instructions
The RS9110-N-11-02 package is moisture sensitive and devices must be
handled appropriately. After the devices are removed from their vacuum
sealed packs, they should be taken through reflow for board assembly within
168 hours at room conditions, or stored at under 10% relative humidity. If
these conditions are not met, the devices must be baked before reflow. The
recommended baking time is nine hours at 125° C.