Data Sheet

12
Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to
12 bits at up to one million samples per second. The integrated input max can select inputs
from 4 external pins and 6 internal signals.
6. RECOMMENDED TEMPERATURE REFLOW PROFILE
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture
absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator
card to display the level maintained during storage and shipment. If directed to bake units on
the card, please check the below Table 8 and follow instructions specified by IPC/JEDEC
J-STD-033.
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher
temperatures displayed in the below Table 8, the modules must be removed from the shipping
tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with
fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity
Level) 3 devices is 168 hours in ambient environment 30°C/60%RH.
Table 8: Recommended baking times and temperatures
Feasycom surface mount modules are designed to be easily manufactured, including reflow
soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate
solder paste and to ensure oven temperatures during reflow meet the requirements of the
solder paste. Feasycom surface mount modules conform to J-STD-020D1 standards for reflow
temperatures.
The soldering profile depends on various parameters necessitating a set up for each
application. The data here is given only for guidance on solder reflow.
MSL
125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp.
Saturated
@
30°C/85%
Floor Life Limit +
72 hours @
30°C/60%
Saturated @
30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
Saturated @
30°C/85%
Floor Life
Limit + 72
hours @
30°C/60%
3 9 hours 7 hours 33 hours 23 hours
13 days 9 days