Specifications

76 GL-S MirrorBit
®
Family IS29GL_128S_01GS_00_Rev.A February 2015
Data Sheet
9.5 Capacitance Characteristics
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
A
= 25°C, f = 1.0 MHz.
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
A
= 25°C, f = 1.0 MHz.
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
A
= 25°C, f = 1.0 MHz.
Table 9.5 Connector Capacitance for FBGA (LAA) Package
Parameter Symbol Parameter Description Test Setup Typ Max Unit
C
IN
Input Capacitance V
IN
= 0 8 9 pF
C
OUT
Output Capacitance V
OUT
= 0 5 7 pF
C
IN2
Control Pin Capacitance V
IN
= 0 4 8 pF
RY/BY# Output Capacitance V
OUT
= 0 3 4 pF
Table 9.6 Connector Capacitance for FBGA (LAE) Package
Parameter Symbol Parameter Description Test Setup Typ Max Unit
C
IN
Input Capacitance V
IN
= 0 7 8 pF
C
OUT
Output Capacitance V
OUT
= 0 5 6 pF
C
IN2
Control Pin Capacitance V
IN
= 0 3 7 pF
RY/BY# Output Capacitance V
OUT
= 0 3 4 pF
Table 9.7 Connector Capacitance for TSOP Package
Parameter Symbol Parameter Description Test Setup Typ Max Unit
C
IN
Input Capacitance V
IN
= 0 7 8 pF
C
OUT
Output Capacitance V
OUT
= 0 5 6 pF
C
IN2
Control Pin Capacitance V
IN
= 0 3 7 pF
RY/BY# Output Capacitance V
OUT
= 0 3 4 pF