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Series 6000 Chip databook
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d.
Comple
ted assemb
lies sh
ould
be place
d in ant
istatic
con
tainers prio
r to bein
g
moved to s
ubsequent st
ation
s.
Figure 55
. Networks
for Minimizing ESD and Reduci
ng CMOS Latch
-
Up Su
scep
tibility
Series 6
000 Chip
Data Bo
ok
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