User Manual

Chengdu Ebyte Electronic Technology Co., Ltd. E180-ZG120A/B Product Specification

Burn program

The module is a SOC module with its own GPIO port, and the program download uses the

J-LINK dedicated downloader

；

Program download interface definition

E180-ZG120 series pins

J-LINK interface

VCC

PF0

SWCLK

PF1

SWDIO

GND

Note: After the second burning, the original firmware will not be available!

Test backplane

The E180-ZG120B-TB test kit is provided. Please check the official website for details.

5.3 hardware design

 It is recommended to use a DC regulated power supply to supply power to the module, the power supply ripple coefficient

should be as small as possible, and the module should be reliably grounded;

 Please pay attention to the correct connection of the positive and negative poles of the power supply, such as reverse connection

may cause permanent damage to the module;

 Please check the power supply to ensure that it is between the recommended supply voltages, if exceeding the maximum value

will cause permanent damage to the module;

 Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;

 When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so

that the whole machine can work stably for a long time;

 The module should be kept away from parts with large electromagnetic interference such as power supply, transformer, and

high-frequency wiring as far as possible;

 High-frequency digital traces, high-frequency analog traces, and power traces must avoid the underside of the module. If it is

absolutely necessary to pass under the module, assuming that the module is soldered on the Top Layer, copper is placed on the

Top Layer of the contact part of the module (all copper is applied). And well grounded), it must be close to the digital part of the

module and routed on the Bottom Layer;

 Assuming that the module is soldered or placed on the Top Layer, it is also wrong to arbitrarily route wires on the Bottom Layer

or other layers, which will affect the stray and receiving sensitivity of the module to varying degrees;

 Assuming that there are devices with large electromagnetic interference around the module, it will also greatly affect the

performance of the module. It is recommended to stay away from the module according to the strength of the interference. If the

situation allows, appropriate isolation and shielding can be done;

 Assuming that there are traces with large electromagnetic interference around the module (high-frequency digital,

high-frequency analog, power traces), it will also greatly affect the performance of the module. It is recommended to stay away

from the module according to the intensity of the interference. isolation and shielding;

 If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of

damage);

 Try to stay away from some TTL protocols whose physical layer is also 2.4GHz, for example: USB3.0;

 The antenna installation structure has a great influence on the performance of the module. Make sure that the antenna is exposed,

preferably vertically upward. When the module is installed inside the casing, a high-quality antenna extension cable can be used