User Manual

Chengdu Ebyte Electronic Technology Co,;Ltd E32-868T30S user manual
Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd.
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10 Production guidance
10.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temp.
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Average ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
max 6 minutes
max 8 minutes
10.2 Reflow soldering curve