User Manual

Chengdu Ebyte Electronic Technology Co., Ltd. E200-470A17SUser Manual
Copyright ©2012–2020，成都亿佰特电子科技有限公司 9
9.3 Sound quality is too bad
 The power supply ripple is too large, so be sure to reduce the power supply ripple, increase the decoupling capacitor,
and increase the EMC filter circuit;
 The audio input wiring is unreasonable, and it needs to be differentially designed and as close as possible to the
module pins;
 The audio input wiring is unreasonable, and it needs to be differentially designed and as close as possible to the
module pins;
 There may be co-channel signal interference nearby, modify the module channel usage;
10. Welding operation guidance
10.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Max preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak
temperature for 25℃
6 minutes max
8 minutes max