User Manual

Chengdu Ebyte Electronic Technology Co., Ltd. E200-470A17SUser Manual
Copyright ©2012–2020，成都亿佰特电子科技有限公司 7
7. Instructions and factory parameters
7.1 Instruction format
The module supports software version reading, and it can be read through the serial port in the transceiver mode (when
reading, only 9600, 8N1 format is supported):
No.
Instruction format
Detailed description
1
Read software
version
instruction：C3 C3 C3
response：E200-470A17S(Vx.x)
example 1:
Send: C3 C3 C3 (hexadecimal format)
Return: E200-470A17S(V1.0)
7.2 Factory default parameters
model
Factory default information：E200-470A17S
Module model
Frequency
Air data rate
Baud rate
Serial port
format
Transmitting power
E200-470A17S
512.273MHz
500kbps
9600bps
8N1
17.5dbm
8. Hardware design
 It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded.
 Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse
connection may cause permanent damage to the module.
 Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;
 Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
 When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
 The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
 Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer;
 Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
 It is assumed that there are devices with large electromagnetic interference around the module that will greatly