User Manual

Chengdu Ebyte Electronic Technology Co., Ltd. E18-2G4U04B User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd.
11
8 Production guidance
8.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for 25℃
max 6 minutes
max 8 minutes
8.2 Reflow soldering curve