User's Manual

Chengdu Ebyte Electronic Technology Co., Ltd E104-BT5032A User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
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10. Production Guidance
10.1 Reflow soldering temperature
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃ 150℃
Preheat temperature max (Tsmax) 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) 3 /second max℃ 3 /second max℃
Liquidous Temperature (TL) 183℃ 217℃
Time（tL）Maintained Above（TL）
60-90 sec 30-90 sec
Peak temperature（Tp）
220-235℃ 230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6 /second max℃ 6 /second max℃
Time 25 to peak temperature℃ 6 minutes max 8 minutes max
10.2 Reflow soldering curve