Specifications

Module：EWN-8852BER3BB-HF
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12.5 Recommended secondary reflux temperature curve
The number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of
the module shall be no less than 1/4.
The lead-free reflux curve requirements of Wi-Fi module products are shown in figure 18：
FIG 18 Furnace temperature curve
NOTE:
1.The maximum furnace temperature of the module is 260℃, don’t exceed this temperature.
2.The gold plating thickness of the module pad is 2u”.