Datasheet

v1.0 / Modification rights reserved

EEH210

9.3. Post reFlow treatment

We strongly recommend high humidity storage of the boards including the sensor packages after reflow soldering. 8hours

at 70±5 °C, 75±5%RH or 24 hours at 80±10%RH (room temperature) is advisable. Calibration or testing should be done

after a short further rest (>1 hour) at room conditions.

9.4. hanDling inFormation

During the whole transportation process it should be avoided to expose the sensor to high concentrations of chemical

solvents for longer time periods. Otherwise the “Reconditioning procedure (9.4)” must be followed.

9.5. reconDitioning ProceDure

After exposure to extreme conditions or chemical solvents or storage time of several months, the sensor characteristic

curve may offset. Exposure to higher temperature will reset the contamination offset (reflow soldering process or e.g.

110°C, 5-7h). When the parts come back to room temperature a humidity exposure to 70±5°C,75±5% RH for 8 hours

completes the reconditioning process.

9.6. temPerature eFFects

Relative humidity strongly depends on temperature. Therefore, it is essential to keep humidity sensors at the same tem-

perature as the air of which the relative humidity is to be measured. In case of testing or qualification the reference sen-

sor and test sensor must show equal temperature to allow for comparing humidity readings.

If the sensor shares a PCB with electronic components that produce heat it should be mounted in a way that prevents

heat transfer or keeps it as low as possible.

Furthermore, there are self-heating effects in case the measurement frequency is too high. To keep self-heating below

0.1°C, EEH210 should not be active for more than 10% of the time – e.g. maximum two measurements per second at

12bit accuracy shall be made.

9.7. light

The EEH210 is not light sensitive but direct exposure to sunshine or strong UV radiation may age the sensor.

9.8. ForbiDDen Packaging materials

Significant concentrations of chemical vapors and long exposure times can influence the characteristic of the sensor.

Outgassing of certain packaging materials in a constant volume such as foams (e.g.: Type MOS 2200) glues, adhesive

tapes and foils are strictly forbidden and may change the characteristic of the sensor.

9.9. wiring anD signal integrity

When this EEH210 is used under I

C mode, carrying the SCL and SDA signal parallel and in close proximity (e.g. in wires)

for more than 10cm may result in cross talk and loss of communication. Furthermore, slowing down SCL frequency will

possibly improve signal integrity.

Under analog output modes, the output pin has to be protected from external noise source to get stable output. Power

supply pins (V

DD, VSS) must be decoupled with a 100 nF capacitor.

10. Document revision history

DATE R-PAGE REVISED CONTENTS TOTAL PAGE REV. NO.

11 April 2016 - Initial release 18 v1.0