Data Sheet

5
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HTE501
1 Pin Configuration
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
SDA
A1
SCL
HI
GND
A3
A2
GND
A3
A2
V
DD
SDA
A1
SCL
HI
Thermal pad internally
connected to GND
V
DD
Top view Bottom view
Figure 1: DFN8 pin configuration
PIN # NAME PIN TYPE DESCRIPTION
1 SDA I/O with pull-up Serial data line for I
2
C communication
2
HI
Output open drain Indicates heater status and measurement invalid
3 A1 Input high-Z
I
2
C device address pin, bit 1 of the 7 bit address;
do not leave floating
4 SCL I/O with pull-up Serial clock line for I
2
C communication
5 V
DD
Power Positive supply pin
6 A2 Input high-Z
I
2
C device address pin, bit 2 of the 7 bit address;
do not leave floating
7 A3 Input high-Z
I
2
C device address pin, bit 3 of the 7 bit address;
do not leave floating
8 GND Power Ground (internally connected to thermal pad)
Table 2: HTE501 pin assignment
2 Typical Application
HTE501
1
4
3
2
8
5
6
7
SDA
A1
SCL
GND
V
DD
A2
A3
�100 nF
GND
3V3
HTE501
1
4
3
2
8
5
6
7
�100 nF
INT
SDA
SCL
V
SS
V
DD
OPTIONAL
8
1
up to 8 sensors / devices
GND
3V3
3V3
3V3
GND
GND
HTE501µC
HTE501
SDA
A1
SCL
GND
V
DD
A2
A3
HI
HI
Figure 2: Typical application schematic