Data Sheet

23
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HTE501
D
A
S
E
T1 x T2
D2
L
b
E2
e
Figure 26: Package layout
PARAMETER SYMBOL MIN. NOM. MAX. UNIT COMMENT
Package width D 2.40 2.50 2.60 mm
Package length E 2.40 2.50 2.60 mm
Package height A 0.80 0.90 1.00 mm
Cavity diameter S 1.30 mm On top of package
Leadframe height A3 0.20 mm Not shown in the drawing
Pad pitch e 0.50 mm
Pad width b 0.20 0.25 0.30 mm
Pad length L 0.30 0.35 0.40 mm
Thermal pad length D2 1.00 1.10 1.20 mm
Thermal pad width E2 1.70 1.80 1.90 mm
Thermal pad marking T1xT2
0.30
x
0.30
mm Indicates pin 1
Table 15: Package dimensions
6.16 Tape and Reel Packaging
The HTE501 has a Moisture Sensitivity Level (MSL) of 1, according to IPC/JEDEC J-STD-020E. At the
same time, it is recommended to further process the sensors within 1 year after date of delivery.
Dimensions T&R in mm:
Figure 27: Tape layout