Datasheet

NEW PRODUCT SPEC SHEET

0.337

0.263

0.2157

0.187

0.174

0.168

0.15

0.19

0.23

0.27

0.31

0.35

0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0

Airflow

(CFM)

( °C / W )

Model Number: A2

• Recommend for AMD® Opteron™ 6100 Series, Socket G34 Processor

• Passive Heat Sink for One-U Server

Overall Specification:

• Overall Dimension: 115.0 x 75.0 x 27.0 mm

• Mounting Pitch 4.1” (104.1 mm)

• Overall Weight: 520 ± 5g

• Material: Copper 1100 with 180° Skiving Fins

• Thermal Resistance 0.17 to 0.34 °C/W, which depends on System Airflow Rate

• Easy Screw-on Captive Mounting

• Thermal Grease Pre-Printed with GE-Toshiba TIG830SP

• Support CPU Power up to 115 Watts

• Bolster Plate is not included

Performance Chart, A2 Thermal Resistance VS. Airflow Rate