Install Manual

Page 7 of 18 D00001685 - D52M SoC ANT Module Draft Data Sheet rev 0.4
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1 D52 ANT SoC Module Series Overview
Dynastream Innovations offers the D52 series of ANT SoC Modules, based on Nordic Semiconductor’s nRF52832 SoC
supporting ANT,
Bluetooth
®
low energy and extended features such as NFC. This expands Dynastream’s portfolio of multi-
protocol ultra-low power wireless modules, popularized with the N5 series of modules. This draft document describes
characteristics of the D52MD2M8IA, the 14.0 x 9.8 x 2.0mm member of the D52 ANT SoC Module Series. General features
of the D52 series include:
Nordic Semiconductor’s nRF52832 chip with 64kB RAM, 512kB Flash and a 32-bit ARM Cortex M4F CPU
Concurrent ANT and Bluetooth low energy protocol operation using supported SoftDevices (pre-compiled protocol
stack solutions for the nRF52 SoCs):
o S212 ANT only SoftDevice from Dynastream Innovations
o S232 concurrent ANT and Bluetooth low energy SoftDevice from Dynastream Innovations
o S132 Bluetooth low energy only SoftDevice from Nordic Semiconductor
Regulatory certification for many global markets
Qualification by the Bluetooth SIG
Onboard 32MHz and 32.768kHz crystal clocks
Preloaded ANT Network Processor Application, which uses the S212 SoftDevice (scalable ANT protocol stack with
15 channel support). The application provides a standard ANT serial interface front-end that can be connected to
an external application controller.
Easy reprogramming via the onboard SWD interface pins using off-the-shelf ARM programming tools.
D52MD2M8IA supports drop-in compatibility with Dynastream M8 modules
2
(including the following models in
certain configurations: N5150M8CD, N550M8CC, N548M8CB).
The D52 series development kit (D52DK1) contains everything necessary to evaluate and begin development with D52
series modules, with support for the Nordic nRF5 SDK.
2
Layouts are compatible when using the SWDIO pin only; the nRF52832 supports separate reset and SWDIO pins rather
than the single shared line from previous Nordic SoCs. Please see section 2.2 for more information.