User's Manual

AP2 RF Transceiver Module 9 of 19
228 River Avenue, Cochrane, Alberta, Canada T4C 2C1 thisisant.com
1.4 Reflow Guideline
Follow the guideline below if AP281M4IB modules go through reflow oven.
Peak solder joint/pad temperatures exceeding 240
ºC are not recommended. If possible, pre-heat the
assembly within the oven profile for ~30 seconds at ~150
ºC. Follow the solder paste manufacturer’s
recommendations, especially regarding temperature ramp rate and the time above liquidus.