Update Description
Table Of Contents
- DSM-04D(MG24) Zigbee Cloud Module Datasheet-V1.0_20221121
- 1Introduction
- 2Mechanical Requirement
- 3Electrical parameters
- 4RF features
- 4.1Basic RF feature
- 4.2RF Transmitter Characteristics
- 4.2.1RF Transmitter General Characteristics for the 2.4
- 4.2.2RF Transmitter Characteristics for 802.15.4 DSSS-O
- 4.2.3RF Transmitter Characteristics for Bluetooth Low E
- 4.2.4RF Transmitter Characteristics for Bluetooth Low E
- 4.2.5RF Transmitter Characteristics for Bluetooth Low E
- 4.2.6RF Transmitter Characteristics for Bluetooth Low E
- 4.3RF Receiver Characteristics
- 4.3.1RF Receiver General Characteristics for the 2.4 GH
- 4.3.2RF Receiver Characteristics for 802.15.4 DSSS-OQPS
- 4.3.3RF Receiver Characteristics for Bluetooth Low Ener
- 4.3.4RF Receiver Characteristics for Bluetooth Low Ener
- 4.3.5RF Receiver Characteristics for Bluetooth Low Ener
- 4.3.6RF Receiver Characteristics for Bluetooth Low Ener
- 5Antenna
- 6Production instructions
- 7Recommended oven temperature curve
- 8Storage conditions
- 9Ordering information
- 10MOQ and packing
- FCC with modular Statement
浙江东胜物联技术有限公司
Zhejiang Dusun Electron Co., Ltd.
杭州市大关路 189 号万通中心 A 幢 8 楼 Floor 8, Building A, Wantong Center
Tel: 86-571-86769027/8 8810480 Hangzhou, China
Website: www.dusuniot www.dusunremotes.com www.dusunlock.com
7 Recommended oven temperature curve
Perform SMT placement based on the following reflow oven temperature curve. The highest
temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
8 Storage conditions
9 Ordering information
DSM-04D- 1
Type
Flash size （1=1024KB；2=1536KB）
10 MOQ and packing
Product
model
MOQ
（
pcs
）
Packing method
Number of Modules in
each reel pack
Number of reel
packs in each box
DSM-04D
2800
Carrier tape and reel
packing
700
4