User's Manual
Table Of Contents
- 1. Overview
- 2. Applications
- 3. Features
- 4. Technical data
- 5. Mechanical size
- 6. Soldering profile
- 7. Pin assignment
- 8. PCB design
- 9. Clock
- 10. Application circuits
- 11. Programming
- 12. Pre-flashed firmware
- 13. Adapter boards
- 14. Radio certification
- 15. Ordering information
- 16. Packaging dimension
- 17. Revision notes
- 18. References
User Manual
Version 1.1c
2013-07-01
OEM radio modules deRFmega
www.dresden-elektronik.de
Page 36 of 52
8.2.2. Footprint of deRFmega128-22M10
The exemplary base board footprint for deRFmega128-22M10 is shown in Figure 27. The
top layer (red) is visible, the mid and bottom layers are hidden. The rectangular signal pad
copper area (red, not visible) and the paste dimension (grey) have the same size of 0.6 x
0.6 mm. The solder stop clearance (purple) has a value of 0.1 mm.
The RF ground pads are connected to each other and to the board ground to ensure a
proper ground area. For the most applications it is not necessary to separate the RF ground
from system ground. The RF ground area in Figure 27 has a vertical dimension of 3.8 mm.
The ground vias are not plugged. In this area are no other radio module signals. An
unintentional short-circuit is therefore accepted. Do not place copper on any other area
among the entire module. Solder stop could be used everywhere.
The RF trace design depends on the used base board and is described detailed in Section
8.5.
Figure 27: Exemplary base board footprint for 22M10 (top view)