User's Manual
Table Of Contents
- 1. Overview
- 2. Applications
- 3. Features
- 4. Technical data
- 5. Mechanical size
- 6. Soldering profile
- 7. Pin assignment
- 8. PCB design
- 9. Clock
- 10. Application circuits
- 11. Programming
- 12. Pre-flashed firmware
- 13. Adapter boards
- 14. Radio certification
- 15. Ordering information
- 16. Packaging dimension
- 17. Revision notes
- 18. References
User Manual
Version 1.1c
2013-07-01
OEM radio modules deRFmega
www.dresden-elektronik.de
Page 35 of 52
Figure 25: RF pad footprint design (top view)
8.2.1. Footprint of deRFmega128-22M00
Figure 26 shows an exemplary base board footprint for deRFmega128-22M00. Only the top
layer (red) is visible. The mid and bottom layers are hidden. The rectangular signal pad
copper area (red, not visible) and the paste dimension (grey) have the same size of 0.6 x
0.6 mm. The solder stop clearance (purple) has a value of 0.1 mm. Do not place copper on
any other area among the entire module. Solder stop could be used everywhere.
Figure 26: Exemplary base board footprint for 22M00 (top view)