Brochure

9
Product Description Features Potential or Typical Uses
Dow Corning
®
EA-6054
Thixotropic
Fast Low-
Temperature
Cure Adhesive
Kit
Black; 2-part (1:1 mix ratio) – fast low temperature heat
cure for faster inline processing; thixotropic – owable
under shear/dipsense conditions then non-flow after
dispensing process; UV indicator for automated inspection;
high tensile stength; cure can be accelerated with elevated
temperatures for faster processing; room temperature
storage
Thixotropic – flowable after shear/
dispense conditions then non-ow;
1:1 mix ratio; heat cure; good cure;
rate at moderate temperatures low
void formation after cure; for
sensitive substrates good working
time after mixing high tensile
strength; UV indicator for inspection
Sealing lids and housings; attaching
baseplates; gasketing; multiple plane
dispensing
Dow Corning
®
Q5-8401
Adhesive Kit
Dark gray; 2-part (1:1 mix ratio) – heat cure; medium
viscosity providing ow/ll/self-leveling after dispensing
process; cure can be accelerated with elevated temperatures
for faster processing; two part system enables deep section
and conned cures; room temperature storage
Flowable; 1:1 mix ratio; heat cure;
high tensile strength; good working
time after mixing; no added solvents
Sealing lids and housings; attaching
baseplates; gasketing; connector
sealing; engine control; ABS;
transmission; lighting
Dow Corning
®
SE 1700 Clear
or White
Translucent; 2-part (10:1 mix ratio); heat cure; non-ow
after dispensing process; long working time after 2-part mix
– reducing need for equipment purge/clean-up; high tensile
strength; cure can be accelerated with elevated temperatures
for faster processing; room temperature storage
Non-owing; 10:1 mix ratio; heat
cure; high tensile strength; good
working time after mixing
Sealing ceramic condensers; sealing
electronic components; bonding
agent for key pad of PCs
Dow Corning
®
SE 1701 LTV
White; 2-part (10:1 mix ratio) – heat cure; medium
viscosity providing ow/ll/self-leveling after dispensing
process; long working time after 2-part mix – reducing need
for equipment purge/clean-up; high tensile strength; cure
can be accelerated with elevated temperatures for faster
processing; room temperature storage
Flowable; 10:1 mix ratio; heat cure;
high tensile strength; good working
time after mixing; no added solvents
Sealing ceramic condensers; sealing
electronic components; bonding
agent for key pad of PCs
Dow Corning
®
SE 1720 CV
1
White; 2-part (1:1 mix ratio) – heat cure; medium viscosity
providing ow/ll/self-leveling after dispensing process;
long working time after 2-part mix – reducing need for
equipment purge/clean-up; cure can be accelerated with
elevated temperatures for faster processing; two-part
system enables deep section and conned cures; controlled
volatility-reducing the potential of volatiles affecting
surrounding components; room temperature storage
Flowable; 1:1 mix ratio; heat cure;
good cure; rate at moderate
temperatures good working time
after mixing controlled silicone
volatility; no added solvents
Sealing lids and housings; attaching
baseplates; gasketing, connector
sealing
Sylgard
®
577
Primerless
Silicone
Adhesive Kit
Gray; 2-part (10:1 mix ratio) – heat cure; medium
viscosity providing ow/ll/self-leveling after dispensing
process; long working time – reducing need for equipment
purge/clean-up; cure can be accelerated with elevated
temperatures for faster processing; two-part system enables
deep section and conned cures; MIL-PRF-23586F QPL
(qualied product listing); high tensile strength; UL 94V-0
ammability rating; room temperature storage
Flowable; 10:1 mix ratio; heat cure;
high tensile strength; long working
time after mixing; no added solvents
Sealing lids and housings; attaching
baseplates; gasketing; connector
sealing
PRODUCT INFORMATION (Continued)
1
Not currently available in Europe.