Brochure

7
Product Description Features Potential or Typical Uses
Dow Corning
®
SE 9186 L
Clear
Translucent; 1 part – no mixing required; moisture cure
(RTV) – no oven required; solvent-free – no ventilation
required; fast tack-free time for faster in-line processing;
cure can also be heat accelerated; low viscosity for quick
ow/ll/self-leveling after dispensing process; controlled
volatility – reducing the potential of volatiles affecting
surrounding components
Fast tack-free RT cure; owable;
controlled silicone volatility; no
added solvents
Parts xing on circuit boards; LCD
module assembly
Dow Corning
®
SE 9187 L
Black or
L Clear or L
White
Black; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast tack-free time for faster in-line processing; cure can
also be heat accelerated; very low viscosity for quick
ow/ll/self-leveling after dispensing process; controlled
volatility-reducing the potential of volatiles affecting
surrounding components; UL 94HB ammability rating
Fast tack-free RT cure; very low
viscosity; controlled silicone
volatility; no added solvents; UL
94HB (black only)
LCD module assembly; LED
module assembly; potting
Dow Corning
®
SE 9188 RTV
2
Gray; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast tack-free time for faster in-line processing; cure can
also be heat accelerated; non-ow after dispensing process;
controlled volatility – reducing the potential of volatiles
affecting surrounding components; UL 94V-0 ammability
rating
Fast tack-free RT cure; non-owing;
controlled silicone volatility; UL
94V-0 flammability rating
Parts xing on CRT, circuit boards
of power supply modules
Dow Corning
®
SE 9189 White
RTV
3
White; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast tack-free time for faster in-line processing; cure can
also be heat accelerated; non-ow after dispensing process;
moderate thermal conductivity; controlled volatility
– reducing the potential of volatiles affecting surrounding
components; UL 94V-0 ammability rating
Fast tack-free RT cure; non-owing;
enhanced thermal conductivity;
controlled silicone volatility; UL
94V-0 flammability rating
Parts xing on circuit boards of
power supply modules
Dow Corning
®
SE 9189 L
Gray or
L White RTV
White; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast tack-free time for faster in-line processing; cure can
also be heat accelerated; low viscosity for quick ow/
ll/self-leveling after dispensing process; controlled
volatility-reducing the potential of volatiles affecting
surrounding components; UL 94V-0 ammability rating
Fast tack-free RT cure; owable;
controlled silicone volatility; no
added solvents; UL V-0 ammability
rating
PDP module assembly; parts xing
on circuit boards
Two-Part Room Temperature Condensation Cure
Dow Corning
®
CY 51-019
White; 2-part (10:1 mix ratio) condensation cure (RTV)
– no oven required; solvent-free – no ventilation required;
cure can be heat accelerated for faster inline process-
ing; low viscosity for quick ow/ll/self-leveling after
dispensing process; no external moisture required to allow
deep-section or conned cures
Low viscosity; cures in deep section
or in connement at RT; no added
solvents
Solar cell sealing
Dow Corning
®
Q3-6093 RTV
Adhesive Kit
Black; 2-part (10:1 mix ratio) condensation cure (RTV)
– no oven required; solvent-free – no ventilation required;
faster room temperature cure to reduce inline processing;
non-ow after dispensing process; no external moisture
required to allow deep-section or conned cures
Non-owing; cures in deep section
or in connement at RT
Sealing lids and housings; attaching
baseplates; gasketing
Dow Corning
®
SE 9206 L
Black
1,3
Black; 2-part (1:1 mix ratio) – condensation cure; low
viscosity for quick ow/ll/self-leveling after dispense;
cure can be accelerated with elevated temperatures for
faster processing; no external moisture required to allow
deep-section or conned cures; controlled volatility
– reducing the potential of volatiles affecting surrounding
components
Flowable; cures in deep section or in
connement at RT; controlled
silicone volatility; no added solvents
Electronic board and module sealing
and protection
One-Part Heat Cure
Dow Corning
®
3-1595 Silicone
Adhesive
1
Gray; 1 part – no mixing required; heat cure; very high
elongation value for vibration/mechanical shock dampening
and low stress; UV indicator for automated inspection;
thixotropic – flowable under shear/dispense conditions then
non-flow after dispensing process
Heat cure; soft, high elongation for
added stress relief; ow after
dispensing varies with shear
conditions; UV indicator for
inspection
Sealing lids and housings; attaching
baseplates; gasketing; connector
sealing; engine control; ABS;
transmission; lighting
Dow Corning
®
3-1598 HP
Black; 1 part – no mixing required; heat cure; medium
viscosity providing ow/ll/self-leveling after dispensing
process; UV indicator for automated inspection; high
tensile strength; low voiding formulation for substrates/
applications that are sensitive to voids
Flowable; heat cure; low void
formation after cure; for sensitive
substrates; high tensile strength; no
added solvents
Sealing lids and housings; attaching
baseplates; gasketing; connector
sealing; engine control; ABS;
transmission; lighting
PRODUCT INFORMATION (Continued)
1
Not currently available in Europe.
2
Not currently available in Americas except in the USA (available in USA).
3
Not currently available in the Americas.