Brochure

6
Product Description Features Potential or Typical Uses
Dow Corning
®
EA-9189 RTV
White
Black; 2-part (1:1 mix ratio) – fast low-temperature heat
cure for faster inline processing; thixotropic – owable
under shear/dispense conditions then non-flow after
dispensing process; UV indicator for automated inspection;
high tensile stength; cure can be accelerated with elevated
temperatures for faster processing; room temperature
storage
Non-owing; room-temperature cure Component xing, power modules
Dow Corning
®
SE 738 White
White; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
cure system can be heat accelerable for faster in-line
processing; non-ow after dispensing process; UL-94HB
ammability rating; high elongation value for vibration/
mechanical shock dampening and low stress
Non-owing; room-temperature
cure; high elongation for added
stress relief; UL 94HB ammability
rating
Fixing capacitors or coils to circuit
boards
Dow Corning
®
SE 9120 Clear
Translucent; 1 part – no mixing required; moisture cure
(RTV) – no oven required; solvent-free – no ventilation
required; fast tack-free time for faster in-line processing;
cure can also be heat accelerated; low viscosity for quick
ow/ll/self-leveling after dispensing process; high
elongation value for vibration/mechanical shock dampening
and low stress; controlled volatility – reducing the potential
of volatiles affecting surrounding components
Fast tack-free RT cure; low
viscosity; controlled silicone
volatility; no added solvents
EL, LCD module assembly; hybrid
IC and PCB coating; encapsulation
of electrical devices
Dow Corning
®
SE 9120 S
White
White; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast cure can also be heat accelerated; tack free time for
faster in-line processing; low viscosity for quick ow/ll/
self-leveling after dispensing process; high elongation value
for vibration/mechanical shock dampening and low stress;
controlled volatility-reducing the potential of volatiles
affecting surrounding components
Fast tack-free RT cure; low
viscosity; controlled silicone
volatility; no added solvents
EL, LCD module assembly
Dow Corning
®
SE 9152 HT
Reddish brown; 1 part – no mixing required; moisture cure
(RTV) – no oven required; solvent-free – no ventilation
required; fast tack-free time for faster in-line processing;
cure can also be heat accelerated; low viscosity for quick
ow/ll/self-leveling after dispensing process; high
temperature resistant (275°C sustained exposure)
Fast tack-free RT cure; low
viscosity; no added solvents; added
heat resistance for sustained 275°C
exposure
Sealing of sheathed heater
terminations
Dow Corning
®
SE 9168 RTV
Gray
Gray; 1 part – no mixing required; moisture cure (RTV)
– no oven required; solvent-free – no ventilation required;
fast tack-free time for faster in-line processing; cure can
also be heat accelerated; non-ow after dispensing process;
controlled volatility-reducing the potential of volatiles
affecting surrounding components; UL 94V-0 ammability
rating
Fast tack-free RT cure; non-owing;
controlled silicone volatility; UL
94V-0 flammability rating
Parts xing on CRT, circuit boards
of power supply modules
Dow Corning
®
SE 9184 White
RTV
White; moderate thermal conductivity; 1 part – no mixing
required; moisture cure (RTV) – no oven required; solvent-
free – no ventilation required; fast tack-free time for faster
in-line processing; cure can also be heat accelerated;
non-ow after dispensing process; controlled volatility
– reducing the potential of volatiles affecting surrounding
components; UL 94V-0 ammability rating
Fast tack-free RT cure; non-owing;
enhanced thermal conductivity;
controlled silicone volatility; UL
94V-0 flammability rating
Parts xing on circuit boards
of power supply modules; heat
transmission for electronics parts
Dow Corning
®
SE 9185 Clear
Translucent; 1 part – no mixing required; moisture cure
(RTV) – no oven required; solvent-free – no ventilation
required; fast tack-free time for faster in-line processing;
cure can also be heat accelerated; non-ow after dispensing
process; high elongation value for vibration/mechanical
shock dampening and low stress; controlled volatility
– reducing the potential of volatiles affecting surrounding
components
Fast tack-free RT cure; non-owing;
high elongation for added stress
relief; controlled silicone volatility
Sealing of electronic equipment
and modules; parts xing on circuit
boards
Dow Corning
®
SE 9186 Clear
or White
Translucent; 1 part – no mixing required; moisture cure
(RTV) – no oven required; solvent-free – no ventilation
required; fast tack-free time for faster in-line processing;
cure can also be heat accelerated; medium viscosity provid-
ing ow/ll/self-leveling after dispensing process; high
elongation value for vibration/mechanical shock dampening
and low stress; controlled volatility – reducing the potential
of volatiles affecting surrounding components
Fast tack-free RT cure; owable;
controlled silicone volatility; no
added solvents
Sealing of electronic equipment
and modules; parts xing on circuit
boards
PRODUCT INFORMATION (Continued)