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Heat cure adhesives can improve manufacturing throughput
due to shorter cure times. The longer working times of heat
cure adhesives provide improved manufacturing flexibility.
A range of cure temperature options is available to optimize
heat and energy costs.
Custom Solutions
Fast Formulation
Dow Corning manufactures a wide variety of adhesives to
meet the needs of most application and process situations,
and we are continuously expanding the product offerings in
each of these families to ensure that there are products to
meet your needs. However, if you cannot nd a match for
your needs, Dow Corning can modify any of our existing
products to help meet your exact needs through our
Fast Formulation process. A few examples of how Fast
Formulation can help meet your exact needs include:
modication of product cure schedule, modulus, viscosity
or color, or adding/removing an inert intermediate such as
UV indicator – all in a timely manner.
Total Support
Product Finder – Dow Corning features a unique interactive
product nder on our website. This tool can help you pick
the right materials for your applications; you can access the
product nder at www.dowcorning.com/electronics and
selecting “Technical Details” on any of our product family
pages.
Production of Prototype Coated Boards or
Process Design
We can produce sample parts, boards or test coupons and
patterns for early evaluation of an adhesive’s abilities and
adhesives can be applied simulating your own process.
Based on our extensive industry experience, we can advise
you on the best methods and conditions for your process.
Analytical, Environmental, and Physical Testing
We have expertise to share on a wide range of testing to
monitor quality, for specialized testing for trouble-shooting,
or to simulate accelerated service conditions.
Equipment Recommendations
Over many years of providing materials for electronics pro-
tection, Dow Corning has developed strong alliances with
key equipment suppliers worldwide. We have launched the
External Equipment Provider Alliance with nine leading
companies. Save time and expense by taking advantage of
these alliances to ensure the optimum integration of material
and processing.
Consultation with Technical Experts
Have our experts visit your facility or join us at one of our
global application centers to work together on your material
and processing needs. We can provide seminars and training
for your personnel to allow them to work more knowledg-
ably. With material, process, and equipment integration
solutions from Dow Corning, you can manufacture more
modules and assemblies in less time, at less cost, with fewer
shutdowns and fewer customer rejects.
Tutorials
An adhesive tutorial can be found on our web site. It is
accessible from the product family pages or the left hand
navigation bar under Technical Library.
Product/Application Information
PREPARING SURFACES
All surfaces should be thoroughly cleaned and/or degreased
with naphtha, mineral spirits, methyl ethyl ketone (MEK),
or other suitable solvent. Light surface abrasion is
recommended whenever possible, because it promotes
good cleaning and increases the surface area for bonding.
A nal surface wipe with acetone or IPA is also useful.
Some cleaning techniques may provide better results than
others; users should determine the best techniques for their
particular applications.
ADHESION
Dow Corning silicone adhesives are specially formulated to
provide unprimed adhesion to many reactive metals, ceram-
ics, and glass, as well as to selected laminates, resins, and
plastics. However, good adhesion cannot be expected on
nonreactive metal substrates or non-reactive plastic surfaces
such as Teflon
®
, polyethylene or polypropylene. Special
surface treatments such as chemical etching or plasma treat-
ment can sometimes provide a reactive surface and promote
adhesion to these types of substrates. Dow Corning
®
brand
Primers (see “Primer Selection Guide,” page 18) can be
used to increase the chemical activity on difcult substrates.
Poor adhesion may be experienced on plastic or rubber
substrates that are highly plasticized, because the mobile
plasticizers act as release agents. Small-scale laboratory
evaluation of all substrates is recommended before produc-
tion trials are made.
In general, increasing the cure temperature and/or cure time
will improve the ultimate adhesion.
SUBSTRATE TESTING
Due to the wide variety of substrate types and differences
in substrate surface conditions, general statements on adhe-
sion and bond strength are impossible. To ensure maximum
bond strength on a particular substrate, 100 percent cohesive
failure of the adhesive in a lap shear or similar adhesive
strength test is desired. This ensures compatibility of the
adhesive with the substrate being considered. Also, this test
can be used to determine minimum cure time or can detect