Brochure

P R O D U C T I N F O R M A T I O N
Information about Dow Corning
®
Brand
Adhesive/Sealants
Silicones and Electronics
Archeological evidence shows that adhesives have been in
use for millennia, and many objects can be seen in museums
that are still bonded with adhesives after 3,000 years or more.
While you may not need that extreme of long-term, reliable
protection, you still want your adhesive to outlast your
device.
While our track record may not be thousands of years old,
we have been making adhesives for electronics almost since
their inception. Many Dow Corning products have been in
continuous use for 30 years or more and are still being applied
today, testifying to the suitability of silicone adhesives for
electronics. Silicones have long been known for durable
dielectric insulation, as barriers against environmental con-
taminants and for their stress-relieving shock and vibration
absorption. They can sustain their physical and electrical
properties over a wide range of temperature, humidity and
other harsh environmental conditions.
Developments over the years have allowed Dow Corning to
add special properties to this durable material foundation in
response to your needs. Some of the more recent develop-
ments include:
Fast tack-free
Lower volatility
Faster or lower temperature cure
Adhesion to difcult current and future substrates
Some of the applications with special needs for which we
are currently developing materials include:
PDP and LCD terminal sealing
Automotive electronics module and sensor sealing
Power supply and SMPS adhering
Electrical instrument adhering and sealing
Circuit board laminating and adhering
Dow Corning
®
brand Adhesives are supplied in three
product forms:
One-Part Moisture Cure RTV
Dow Corning one-part moisture cure adhesives are gener-
ally cured at room temperature and in a range of 20 to 80
percent relative humidity. Greater than 90 percent of their
full physical properties should be attained within 24 to 72
hours depending on the product chosen and application
specics. These materials are not typically used for highly
conned or deep section cures. Materials will generally cure
about 0.25 inch per seven days from any exposed surface.
Cure progresses from the outer surface and is dependent on
the moisture in the air. Materials and parts can generally be
handled within a few minutes to an hour or two once a sur-
face skin forms. Mild heat acceleration of the cure rate may
be possible, but temperatures above 60°C (140°F) are not
recommended.
Two-Part Room Temperature Condensation Cure
Dow Corning two-part RTV adhesives cure rapidly at room
temperature after mixing. Good strength is attained within
an hour but full properties are not reached for a number of
days. These adhesives contain their own source of mois-
ture, and cure progresses evenly throughout the material.
Deep-section or conned cures are possible; however, some
limitations exist. Refer to the “Reversion” section of this
datasheet for additional information.
Room temperature adhesives contribute to lower manu-
facturing costs by avoiding the energy required for heat
cure adhesives. These adhesives are also well suited for
temperature-sensitive substrates that preclude the use of
heat cure adhesives.
Heat Cure
Most Dow Corning addition-curing adhesives should be
cured at 90°C (198°F) or above; however, Dow Corning
®
SE 1720 CV has been formulated to cure quickly down to
as low as 70°C (158°F). The cure rate is rapidly accelerated
with heat (see cure schedules in table). For thicker sections
or if voiding is observed, use of one of the newer low-
voiding adhesives or a 30-minute pre-cure at 70°C (158°F)
may reduce voids in the elastomer. Addition-curing materi-
als contain all the ingredients needed for cure with no
byproducts from the cure mechanism. Deep-section or con-
ned cures are possible. Cure progresses evenly throughout
the material.

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