User's Manual

DIGITAL-LOGIC AG MSM855/HLV/B/B2 Detailed Manual V1.0A
101
10. THERMAL SPECIFICATIONS
10.1. Thermal Analysis for Case Integration
Since the integrated heat sink is uni-directional, the airflow must be exactly in the direction of the heat rails. If
possible, mount the board vertically, so that the heat rails are up/down. In this case, the self produced airflow
is about 3m/sec.
Pay particular attention when mounting the PC-product in a fully enclosed case/box. The thermal energy will
be stored in the inner room of this environment.
If the case has a fan:
 The hot air must be exchanged with cool air from outside using a filtered fan.
 The hot air must be cooled with a heat exchanger.
If the case has no fan or opening to exchange the hot air:
 The heat sink of the CPU must be mounted directly to a heat sink integrated in the case. The thermal
energy does not go through the air; the heat will be conducted directly through the alloy of the heat
sink to the outside.
 Diminish the thermal energy production by reducing the CPU performance, i.e. by using the 600MHz
clock only.