Specifications

PRODUCT SPECIFICATION
Version 2.4 23 August 2011 22 / 28
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited.
8. RELIABILITY TEST
8.1
RELIABILITY TEST CONDITION
No. Test Item Test Condition Note
1 High Temperature Storage
95℃, 240 hours
2 Low Temperature Storage
-40℃, 240 hours
3 Thermal Shock Storage
{(-40℃, 0.5 hour) (85℃, 0.5 hour)}, 100 cycles
4 High Temperature Operating
85℃, 240 hours
5 Low Temperature Operating
-30℃, 240 hours
6 High Temperature & High Humidity Operating
60℃, 90% RH, 240hours
(1) (2)
7 Shock (Non-Operating)
100G, 6ms, half sine wave, 3 times for ± X, ± Y,
± Z.
(3)
8 Vibration (Non-Operating)
3G, 10 ~ 200 Hz, 10min/cycle, 3 cycles each X,
Y, Z
(3)
Note (1) There should be no condensation on the surface of panel during test.
Note (2) The temperature of panel display surface area should be 95℃ Max.
Note (3) At testing Vibration and Shock, the fixture in holding the module has to be hard and rigid enough
so that the module would not be twisted or bent by the fixture.
Note (4) In the standard conditions, there is no function failure issue occurred. All the cosmetic specification
is judged before the reliability test.
Data Modul AG - www.data-modul.com