Specifications

IN
ST
CL
CS
OUT
VS
DIAG_EN
GND
IGND
Vout
Vs
VCS
VCL
VDIAG
V
ST
VIN
IOUT
IS
IIN
IST
IDIAG
ICL
ICS
TPS1H100-Q1
SLVSCM2A –OCTOBER 2014–REVISED JANUARY 2014 www.ti.com
Figure 1. Pin Current and Voltage Conventions
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)(3)
MIN MAX UNIT
Supply voltage
(4)
, t < 400 ms 48 V
Reverse polarity voltage
(5)
–18 V
Continuous drain current Internally limited A
Reverse current on GND –50 20 mA
Reverse current on GND, t < 120 s –250 20 mA
Voltage on IN/DIAG_EN pin –0.3 7 V
Current on IN /DIAG_EN pin –30 2 mA
Voltage on ST pin –0.3 7 V
Current on ST pin –30 10 mA
IN pin PWM frequency 2 KHz
Voltage on CL pin –0.3 7 V
Current on CL pin –2 30 mA
Voltage on CS pin –2.7 6.5 V
Current on CS pin –2 30 mA
Inductive load switch-off energy dissipation single pulse
(6)
70 mJ
Operating ambient temperature –40 125 °C
Operating junction temperature –40 150 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Absolute negative voltage on these terminals is not to go below –0.3 V.
(4) Absolute maximum voltage, withstand 48-V load dump voltage for 400 ms.
(5) Reverse polarity condition: t < 60 s, reverse current < Irev1, GND pin 1-kΩ resistor in parallel with diode.
(6) Test condition: V
S
= 13.5 V, L = 8 mH, R = 0 Ω, T
J
= 150°C. FR4 2s2p board, 2- × 70-μm Cu, 2- × 35-μm Cu. 600-mm
2
thermal pad
copper area.
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