Specifications

J A JA T
T T R P
T
 u
2
T OUT DSON S nom
P I R V I u  u
VS
VS
VS
OUT
OUT
OUT
13
1
2
3
4
5
6
7
8
9
10
11
12
14
GND
NC
IN
NC
NC
ST/CS
DIAG_EN
CL
Thermal
Pad
GND Network
TPS1H100-Q1
SLVSCM2A –OCTOBER 2014–REVISED JANUARY 2014 www.ti.com
Layout Example (continued)
11.2.2 With a GND Network
With a GND network, tie the thermal pad as one trace to the board GND copper after the GND network.
Figure 51. With a GND Network Layout
11.3 Thermal Considerations
This device possesses thermal shutdown (TSD) circuitry as a protection from overheating. For continuous normal
operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature
exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls below the
thermal-shutdown trip point, the output turns on again.
Calculate the power dissipated by the device according to Equation 13.
where
• P
T
= Total power dissipation of the device (13)
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
(14)
38 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: TPS1H100-Q1