Specifications

VS
VS
VS
OUT
OUT
OUT
13
1
2
3
4
5
6
7
8
9
10
11
12
14
Thermal
Pad
GND
NC
IN
NC
NC
ST/CS
DIAG_EN
CL
TPS1H100-Q1
www.ti.com SLVSCM2A –OCTOBER 2014–REVISED JANUARY 2014
10 Power Supply Recommendations
The device is qualified for both automotive and industrial applications. The normal power supply connection is a
12-V automotive system or 24-V industrial system. Detailed supply voltage should be within the range specified
in the Recommended Operating Conditions.
11 Layout
11.1 Layout Guidelines
To prevent thermal shutdown, T
J
must be less than 150° C. If the output current is very high, the power
dissipation may be large. The HTSSOP package has good thermal impedance. However, the PCB layout is very
important. Good PCB design can optimize heat transfer, which is absolutely essential for the long-term reliability
of the device.
• Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-
flow path from the package to the ambient is through the copper on the PCB. Maximum copper is extremely
important when there are not any heat sinks attached to the PCB on the other side of the package.
• Add as many thermal vias as possible directly under the package ground pad to optimize the thermal
conductivity of the board.
• All thermal vias should either be plated shut or plugged and capped on both sides of the board to prevent
solder voids. To ensure reliability and performance, the solder coverage should be at least 85%.
11.2 Layout Example
11.2.1 Without a GND Network
Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.
Figure 50. Without a GND Network Layout
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