Specifications

INPUT
VOUT
V
BAT
IOUT
V
DS, clamp
t
DECAY
E
HSD
R
R
VBAT
+
-
IN
SOURCE
DRAIN
GND
-
L
TPS1H100-Q1
SLVSCM2A –OCTOBER 2014–REVISED JANUARY 2014 www.ti.com
Feature Description (continued)
Figure 32. Driving Inductive Load
Figure 33. Inductive Load Switching Off Diagram
As discussed previously, when switching off, battery energy and load energy are dissipated on the high-side
power switch, which leads to the large thermal variation. For each high-side power switch, the upper limit of the
maximum safe power dissipation depends on the device intrinsic capacity, ambient temperature, and board
dissipation condition. TI provides the upper limit of the maximum single pulse energy that devices can tolerant
under the test condition: V
S
= 13.5 V, inductance from 0.1 to 400 mH, R = 0 Ω, FR4 2s2p board, 2- × 70- μm
copper, 2- × 35-μm copper, thermal pad copper area 600 mm
2
.
For one dedicated inductance, users can refer to Figure 34. If the maximum switching off current is smaller than
the current value shown on the curve, the internal clamp function can be used for the demagnetization energy
dissipation. If not, the external free-wheeling circuitry is necessary for device protection.
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