Display Elektronik GmbH OLED-MODULE DEP 256064C–W Product Specification Ver.: 3 01.06.
DEP 256064C-Y Production Specification 1. Revision History VERSION DATE Note 0 1 2 3 23.06.2014 03.12.2014 22.12.2015 01.06.
DEP 256064C-Y Production Specification Contents 1. General Specification 2. Interface Pin Function 3. Counter Drawing & Block Diagram 4. Absolute Maximum Ratings 5. Electrical Characteristics 6. Optical Characteristics 7. OLED Lifetime 8. Reliability 9. Inspection specification 10.
DEP 256064C-Y Production Specification 1. General Specification The Features is described as follow: n Module dimension: 88.00 x 27.80 x 2.05 mm n Active area: 76.778 x 19.178 mm n Dot Matrix : 256 x 64 Dots n Dot Size: 0.278 x 0.278 mm n Dot Pitch: 0.30 x 0.
DEP 256064C-Y Production Specification 2. Interface Pin Function Pin Number Symbol Power Supply 26 VCI I/O Function P 25 VDD P 24 VDDIO P 2 VSS P 3,29 VCC P 5,28 VLSS P IREF I 4 VCOMH P 27 VSL P Driver 22 Version: 3 Power Supply for Operation This is a voltage supply pin. It must be connected to external source & always be equal to or higher than VDD & VDDIO. Power Supply for Core Logic Circuit This is a voltage supply pin.
DEP 256064C-Y Testing Pads 21 Production Specification FR O 16 17 BS0 BS1 I 20 RES# I 19 CS# I 18 D/C# I 14 E/RD# I 15 R/W# I 6~13 D7~D0 Version: 3 I/O Frame Frequency Triggering Signal This pin will send out a signal that could be used to identify the driver status. Nothing should be connected to this pin. It should be left open individually. Communicating Protocol Select These pins are MCU interface selection input.
DEP 256064C-Y Production Specification These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Unused pins must be connected to VSS except for D2 in serial mode. Reserve 23 1,30 Version: 3 N.C. - N.C. (GND) - Reserved Pin The N.C. pin between function pins are reserved for compatible and flexible design.
DEP 256064C-Y Production Specification 3. Counter Drawing & Block Diagram 88.0¡ 0Ó.3(P anel Size) 88.0¡ 0Ó.3(C ap Size) 87.0¡ 0Ó.3(P olarizer) 2.0 3.0 19.178(AA) 0.5¡ 0Ó.5 78.78(V A ) 5.61 76.778(A A ) 2 .05 0 .7 1 .1 A ctiv e A rea 3.12" 256*64 Pixels R EM O V E TA PE T = 0.15M ax 2-R 0.5¡ 0Ó.05 0.3 ¡ 0Ó.05 0.8M A X 40.0¡ 0Ó.1 60.0¡ 0Ó.2 0.3 0.278 0.3 14.0 S tiffener 4.0 4.36 4.0 3.0 1 30 0.3 0 .5 P 0.5*29= 14.5 15.50 C ontact S ide 0.278 8.7 S S D 1 3 22 9.2 11.01 25.
DEP 256064C-Y Production Specification FUNCTION BLOCK DIAGRAM *For more information, please contact Display Elektronik GmbH.
DEP 256064C-Y Production Specification 4. Absolute Maximum Ratings Parameter Symbol Supply Voltage for Operation VCI Supply Voltage for Logic VDD Supply Voltage for I/O Pins VDDIO Supply Voltage for Display VCC Operating Temperature TOP Storage Temperature TSTG Min Max Unit Notes -0.3 -0.5 -0.5 -0.5 -40 -40 4 2.75 VCI 20 80 80 V V V V °C °C 1, 2 1, 2 1, 2 1, 2 - Note 1: All the above voltages are on the basis of “VSS = 0V”.
DEP 256064C-Y Production Specification 5. Electrical Characteristics Item Symbol Condition Min Typ Max Unit Supply Voltage for Logic VDD － 2.8 3.0 3.3 V Supply Voltage for Display VCC － 10 12 15 V High Level Input Low Level Input High Level Output Low Level Output 50% Check Board operating Current VIH VIL VOH VOL － － － － 0.8×VDD 0 0.9×VDD 0 － － － － VDD 0.2×VDD VDD 0.
DEP 256064C-Y Production Specification 6. Optical Characteristics Item View Angle Contrast Ratio Response Time Symbol Condition (V)θ － 160 － － deg (H)φ － 160 － － deg CR Dark 2000:1 － － － T Rise － － 10 － μs T Fall － － 10 － μs 60 80 － cd/m2 Display with 50% check Board Brightness Min Typ Max Unit CIEx(White) (CIE1931) 0.26 0.28 0.30 － CIEy(White) (CIE1931) 0.30 0.32 0.
DEP 256064C-Y Production Specification 7. OLED Lifetime ITEM Conditions Operating Life Time Ta=25°C / Initial 50% check board brightness Typical Value Min Typ 20,000 Hrs - Remark Note Notes: 1. Life time is defined the amount of time when the luminance has decayed to <50% of the initial value. 2. This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function (pdf) for the product under normal use conditions. 3.
DEP 256064C-Y Production Specification 8. Reliability Content of Reliability Test Environmental Test Test Item High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Storage Temperature Cycle Content of Test Test Condition Applicable Standard Endurance test applying the high storage temperature for a long time. 80°C 240hrs —— Endurance test applying the low storage -40°C temperature for a long time.
DEP 256064C-Y Production Specification Test and measurement conditions 1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 2. All-pixels-on is used as operation test pattern. 3.
DEP 256064C-Y Production Specification 9. Inspection specification NO 01 02 03 04 Item Electrical Testing Black or white spots on OLED (display only) OLED black spots, white spots, contamina tion (non-displ ay) Polarizer bubbles Version: 3 Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 OLED viewing angle defect. 1.
DEP 256064C-Y NO 05 Item Scratches Production Specification Criterion Follow NO.3 OLED black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length: AQL 6.1 General glass chip : 6.1.
DEP 256064C-Y NO Item Production Specification Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : y: Chip width x: Chip length y≦0.5mm x≦1/8a 6.2.2 Non-conductive portion: 06 AQL z: Chip thickness 0 ＜ z≦t Glass crack 2.
DEP 256064C-Y NO 07 08 09 10 11 Item Cracked glass Backlight elements Production Specification Criterion AQL The OLED with extensive crack is not acceptable. 2.5 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using OLED spot, lines and contamination standards. 8.3 Backlight doesn’t light or color wrong. 0.65 2.5 0.65 Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.
DEP 256064C-Y NO 12 Production Specification Item Criterion AQL 2.5 General appearance 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.
DEP 256064C-Y Production Specification Check Item Classification No Display Major Missing Line Major Pixel Short Major Darker Short Major Wrong Display Major Un-uniform B/A x 100% < 70% A/C x 100% < 70% Major Version: 3 Criteria PAGE: 21
DEP 256064C-Y Production Specification 10. Precautions in use of OLED Modules (1) Avoid applying excessive shocks to module or making any alterations or modifications to it. (2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of OLED display module. (3) Don’t disassemble the OLED display module. (4) Don’t operate it above the absolute maximum rating. (5) Don’t drop, bend or twist OLED display module. (6) Soldering: only to the I/O terminals.
DEP 256064C-Y Production Specification (7) Do not apply stress to the LSI chips and the surrounding molded sections. (8) Do not disassemble nor modify the OLED display module. (9) Do not apply input signals while the logic power is off. (10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OLED display modules.
