Display Elektronik GmbH OLED-MODULE DEP 16101–W Product Specification Ver.: 3 08.01.
DEP 16101-W Production Specification Revision History VERSION DATE 0 06.04.2011 First Release 1 02.07.2011 Change Version 2 23.08.2012 3 08.01.2014 Correct Operating Lifetime Update Rev. Version: 3 REVISED PAGE NO.
DEP 16101-W Production Specification Contents 1. General Specification 2. Interface Pin Function 3. Counter Drawing & Block Diagram 4. Absolute Maximum Ratings 5. Electrical Characteristics 6. Optical Characteristics 7. OLED Lifetime 8. Reliability 9. Inspection specification 10.
DEP 16101-W Production Specification 1. General Specification The Features is described as follow: n Module Dimension: 80.00 x 36.00 x 10.00 (max.) mm n Viewing Area: 66.00 x 16.00 mm n Active Area: 56.95 x 6.35 mm n Number of Characters: 16 Characters x 1 Line n Dot Size: 0.55 x 0.75 mm n Dot Pitch: 0.60 x 0.80 mm n Character Size: 2.95 x 6.35 mm n Character Pitch: 3.60 x 6.
DEP 16101-W Production Specification 2. Interface Pin Function Pin No. Symbol Level Description 1 VSS 0V Ground 2 VDD 5.
DEP 16101-W Production Specification 3.
DEP 16101-W Version: 3 Production Specification PAGE: 7
DEP 16101-W Production Specification 4. Absolute Maximum Ratings Item Symbol Min Max Unit Notes Operating Temperature TOP -40 +80 °C - Storage Temperature TST -40 +80 °C - Supply Voltage For Logic VDD-VSS -0.3 5.
DEP 16101-W Production Specification 5. Electrical Characteristics Item Symbol Condition Min Typ Max Unit VDD-VSS － 4.8 5.0 5.3 V Input High Voltage VIH － 0.8 VDD － VDD V Input Low Voltage VIL － GND － 0.2 VDD V Supply Voltage For Logic Output High Voltage VOH IOH=-0.5mA 0.8 VDD － VDD V Output Low Voltage VOL IOL=0.5mA GND － 0.2 VDD V IDD VDD=5V 16 18 22 mA 50% Check Board Operating Current Note: In order to avoid any possible damages, 3V or 3.
DEP 16101-W Production Specification 6. Optical Characteristics Item Viewing Angle Contrast Ratio Response Time Symbol Condition Min Typ Max Unit (V)θ 160 deg (H)φ 160 deg CR Dark T rise － 10 μs T fall － 10 μs 50 60 cd/m2 Display with 50% check Board Brightness 2000:1 － － CIEx(White) (CIE1931) 0.26 0.28 0.30 - CIEy(White) (CIE1931) 0.30 0.32 0.
DEP 16101-W Production Specification 7. OLED Lifetime ITEM Operating Life Time Conditions Ta=25°C / Initial 50% check Board Typical Brightness Value Min Typ Remark 40,000 Hrs 50,000 Hrs Note Note: 1. Life time is defined the amount of time when the luminance has decayed to <50% of the initial value. 2. This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function (pdf) for the product under normal use conditions. 3.
DEP 16101-W Production Specification 8. Reliability Content of Reliability Test Environmental Test Test Item Content of Test High Temperature storage Endurance test applying the high storage temperature for a long time.
DEP 16101-W Production Specification Test and measurement conditions 1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 2. All-pixels-on is used as operation test pattern. 3.
DEP 16101-W Production Specification 9. Inspection specification NO 01 02 03 04 Item Electrical Testing Black or white spots on OLED (display only) OLED black spots, white spots, contamina tion (non-displ ay) Polarizer bubbles Version: 3 Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 OLED viewing angle defect. 1.
DEP 16101-W NO 05 Item Scratches Production Specification Criterion Follow NO.3 OLED black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length: AQL 6.1 General glass chip : 6.1.
DEP 16101-W NO Item Production Specification Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : y: Chip width x: Chip length y≦0.5mm x≦1/8a 6.2.2 Non-conductive portion: 06 AQL z: Chip thickness 0 ＜ z≦t Glass crack 2.
DEP 16101-W NO 07 08 09 10 11 Item Cracked glass Backlight elements Production Specification Criterion AQL The OLED with extensive crack is not acceptable. 2.5 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using OLED spot, lines and contamination standards. 8.3 Backlight doesn’t light or color wrong. 0.65 2.5 0.65 Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.
DEP 16101-W NO 12 Production Specification Item Criterion AQL 2.5 General appearance 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.
DEP 16101-W Production Specification Check Item Classification No Display Major Missing Line Major Pixel Short Major Darker Short Major Wrong Display Major Un-uniform B/A x 100% < 70% A/C x 100% < 70% Major Version: 3 Criteria PAGE: 19
DEP 16101-W Production Specification 10. Precautions in use of OLED Modules (1) Avoid applying excessive shocks to module or making any alterations or modifications to it. (2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of OLED display module. (3) Don’t disassemble the OLED display module. (4) Don’t operate it above the absolute maximum rating. (5) Don’t drop, bend or twist OLED display module. (6) Soldering: only to the I/O terminals.
DEP 16101-W Production Specification (7) Do not apply stress to the LSI chips and the surrounding molded sections. (8) Do not disassemble nor modify the OLED display module. (9) Do not apply input signals while the logic power is off. (10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OLED display modules.
