Datasheet

DEM 16227 SYH-LY Product Specification
VERSION: 2 PAGE: 22
the gold finger of FPC and PCB. Pierced or
folded FPC/FFC exceeding limit sample.
6.9.2
Poor
reinforcing
band
The protect tape using for reinforce which not
complete covered the needed protection
circuits (such as H/S, FFC, FPC, etc.) or it not
joint with its pasted material or it glued on the
output side of pins.
Reject √
6.9.3 Surface dirt
The surface of finished LCMs with smudge,
residual glue, and finger prints, etc; solder
spatters or solder balls on non-soldered area
of PCB/COB.
Non-removed defect mark or label on LCMs.
Reject √
6.9.4
Assembly
black spot
Smears or black spots found on LCMs after
backlight or diffusion barrier are assembled.
Refer to
6.2.1
√
6.9.5
Product
mark
Missing, unclear, incorrect, or misplaced part
numbers and/or batch marks.
Reject √
6.9.6
Inner
packing
Packing being inconsistent with quantity and
part number on packing label, specifications
or the customer order - either short-packed or
over-packed.
Reject √
6.9.7 Dimension According to drawing √
Notes ： The criterion apply to all kinds of LCM products, ignore the related articles if product doesn’t
contain the components which are defined in 6.3~6.9.
Others
Items not specified in this document or released on compromise should be inspected witreference
to mutual agreement and limit samples.