Datasheet

DEM 16227 SYH-LY Product Specification
VERSION: 2 PAGE: 21
6.7.6
Poor
Appearance
The LCMs become yellow-brown or black as
the residual resin or solder oil. There is white
mist residual at the solder point caused by
PCB cleaning.
Reject √
Anything which is not clearly defined in 6.5~6.7 should refer to IPC-A-610E.
6.8 Hot Pressing components (including H/S，FPC, etc.）
No. Defects Description
Acceptance
standard
MAJ MIN
6.8.1
Out of its
specification
Reject √
6.8.2 Size Refer to its drawing √
6.8.3 Position
Note: H=ITO pin length, W=ITO pin width,
f= heat seal or the misplaced width of TAB.
1, If f≤1/3w，h
≤1/3H, and its
conform to the size
and specification on
drawing, which will
be received.
2, The contact area
of dielectric material
conductor position
and pressing
material over 1/2
(controlling as per
each ITO position)
will be received.
√
6.8.4
Foreign
Matter in
Hot
pressing
area
If foreign matter in non-conductive heat
compression area shall not cause short, it
is OK. If foreign matter in conductive heat
compression area does not exceed 50% of
the heat pressure area, it is OK.
Receive √
6.8.5 Fold marks
Refer to the limited
samples.
√
6.8.6
Tension/
pulling force
Normally pulled up at a 90 degree angle
vertical to PIN
Heat seal paper:
larger than 350
g/cm
FPC: larger than
700 g/cm （
H>0.3mm）
√
6.9 General Appearance
No. Defects Description
Acceptance
standard
MAJ MIN
6.9.1
Connection
material
Damaged or contaminated FPC or H/S gold
fingers or FFC contact pin side with exposed
copper foil or base materials.
Sharp folds on FPC, FFC, COF, H/S (unless
designed for).
Solder paste larger than 2/3 of pin width on
Reject √
w
f
H
h
h2
H
h1