Datasheet

DEM 16227 SYH-LY Product Specification
VERSION: 2 PAGE: 20
customer and specified in the mechanical
drawing and/or component specifications,
their specifications must conform to those of
the suppliers; otherwise they shall be
rejected.
6.6 Connector and other components
No. Defects Description
Acceptance
standard
MAJ
MIN
6.6.1
Out of
Specificatio
n
The specification of connector and other
components do not conform to the drawing.
Reject
6.6.2
Position and
order
Solder position and Pin# 1 should be in the
positions specified by the drawing.
Reject
6.6.3 Appearance
1Flux on PCB components and pins.
2The pin width of a PIN connector exceeds
½ of the specified pin width.
Reject
6.6.4 Glue amount
Flat cable connector: as the conducted wire
fixed with glue, if the glue not fully covered
the exposed wire and the copper part around
holes will be rejected.
Reject
6.6.5
Through
holes
blocked
Socket connector: the components can not
plug-in units as the through holes blocked
and deformation; the locks which with lock
catch can not make the external connector to
be locked.
Reject
6.7 SMT (Refer to IPC-A-610E the second standard if not specified)
No. Defects Description
Acceptance
standard
MAJ MIN
6.7.1
Soldering
solder
defects
Cold, false and missing soldering, solder crack
and insufficient solder dissolution.
Reject
6.7.2
Solder
ball/splash
Solder ball/tin dross causing short circuit at the
solder point. There are active solder ball and
splash.
Reject
6.7.3 DIP parts
Floated or tilted DIP parts, keypad, and
connectors.
Reject
6.7.4
Solder
shape
The welded spot should be concave and
excessive or insufficient solder or solder burr
on the welded spot must be rejected.
Reject
6.7.5
Component
pin
exposure
For the DIP type components, 0.5~2mm
component pin must be remained after cutting
the soldered pin and the solder surface neither
should not be damaged nor should the
component pin is fully covered with solder;
otherwise rejected.
Reject