Datasheet

1
) Mounted on P.C. board with 25 mm
2
copper pads at each terminal
Montage auf Leiterplatte mit 25 mm
2
Kupferbelag (Lötpad) an jedem Anschluß
185
01.04.2000
SM 4001 … SM 4007
SM 513, SM 516, SM 518, SM 2000
Rating for fusing – Grenzlastintegral t < 10 ms T
A
= 25/C i
2
t 12.5 A
2
s
Peak forward pulse current t = 1ms T
A
= 85/C I
FSM
100 A
Max. zulässiger Stromimpuls
Operating junction temperature – Sperrschichttemperatur T
j
– 50...+175/C
Storage temperature – Lagerungstemperatur T
S
– 50...+175/C
Characteristics Kennwerte
Forward voltage – Durchlaßspannung T
j
= 25/C I
F
= 1 A V
F
< 1.1 V
Leakage current – Sperrstrom T
j
= 25/C V
R
= V
RRM
I
R
< 5 :A
T
j
= 100/C V
R
= V
RRM
I
R
< 50 :A
Thermal resistance junction to ambient air R
thA
< 45 K/W
1
)
Wärmewiderstand Sperrschicht – umgebende Luft
Thermal resistance junction to terminal R
thT
< 10 K/W
Wärmewiderstand Sperrschicht – Kontaktfläche