Datasheet

SK12 ... SK110
Characteristics Kennwerte
Leakage current
Sperrstrom
T
j
= 25°C
T
j
= 100°C
V
R
= V
RRM
V
R
= V
RRM
I
R
I
R
< 0.5 mA
< 5.0 mA
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
R
thA
< 70 K/W
1
)
Thermal resistance junction to terminal
Wärmewiderstand Sperrschicht − Anschluss
R
thT
< 30 K/W
1 Mounted on P.C. board with 25 mm
2
copper pads at each terminal
Montage auf Leiterplatte mit 25 mm
2
Kupferbelag (Lötpad) an jedem Anschluss
2 http://www.diotec.com/ © Diotec Semiconductor AG
Rated forward current vs. temp. of the terminals
in Abh. v. d. Temp. der TerminalsZul. Richtstrom
120
100
80
60
40
20
0
I
FAV
[%]
[°C]
T
T
150100
50
0
10
4
10
10
10
1
3
2
1
[µA]
I
R
0
V
RRM
40 60 80 100
[% ]
Typ. instantaneous leakage current vs. reverse voltage
Typ. Sperrstrom (Augenblickswert) ü. Sperrspannung
T = 25°C
j
T = 75°C
j
T = 100°C
j
20V...40V
[A]
I
F
Forward characteristics (typical values)
Durchlasskennlinien (typische Werte)
0
V
F
0.4 0.6
[V]
1.0
10
10
1
10
10
2
-1
-2
SK18...110
25°C
SK15...16
SK12...14
125°C
[pF]
[V]
C
j
V
R
T = 25°C
f = 1.0 MHz
j
Junction capacitance vs. reverse voltage (typical)
Sperrschichtkapazität in Abh. v.d. Sperrspg. (typ.)
20V...40V
50V...100V