User guide

ISSUE 2 - SEPTEMBER 2005
FCX605
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a) R
θJA
125 °C/W
Junction to Ambient (b) R
θJA
45 °C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐5 secs.
2
ABSOLUTE MAXIMUM RATINGS.
PARAMETER SYMBOL LIMIT NPN UNIT
Collector-Base Voltage V
CBO
140 V
Collector-Emitter Voltage V
CEO
120 V
Emitter-Base Voltage V
EBO
10 V
Peak Pulse Current I
CM
4A
Continuous Collector Current I
C
1A
Power Dissipation at TA=25°C (a)
Linear Derating Factor
P
D
1
8
W
mW/°C
Power Dissipation at TA=25°C (b)
Linear Derating Factor
P
D
2.8
22
W
mW/°C
Operating and Storage Temperature Range T
j
:T
stg
-55 to +150 °C