Manual

DRDC3105
Document number: DS35213
Rev. 4 - 2
2 of 9
www.diodes.com
March 2013
© Diodes Incorporated
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Diodes Incorporated
DRDC3105
Internal Device Schematic
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Limit Unit
Supply Voltage
V
CC
6.0 V
Input Voltage (Forward)
V
IN
(
FWD
)
6.0 V
Input Voltage (Reverse)
V
IN
(
REV
)
-0.5 V
Output Sink Continuous Current
I
O
500 mA
Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%)
E
z
p
k
50 mJ
Thermal Characteristics for DRDC3105F (SOT23) (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
(Note 5)
P
D
310
mW
(Note 6) 350
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
403
°C/W
(Note 6) 357
Thermal Resistance, Junction to Leads (Note 11)
R
θJL
350 °C/W

Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150 °C
Thermal Characteristics for DRDC3105E6 (SOT26) (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
Linear Derating Factor
(Note 7 & 9)
P
D
0.9
7.2
W
mW/°C
(Note 7 & 10)
1.1
8.8
(Note 8 & 10)
1.7
13.6
Thermal Resistance, Junction to Ambient
(Note 7 & 9)
R
θJA
139
°C/W
(Note 7 & 10) 113
(Note 8 & 10) 73
Thermal Resistance, Junction to Leads (Note 11)
R
θJL
100 °C/W

Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150 °C
Notes: 5. For a device mounted on minimum recommended pad layout 1oz weight copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 15mm X 15mm 1oz copper.
7. Same as Note 5, except the device is mounted on 25mm X 25mm 1oz copper.
8. Same as Note 7, except the device is measured at < 5sec
9. For a device with one active die.
10. For a device with two die running at equal power.
11. Thermal resistance from junction to solder-point (at the end of the “OUT” lead).
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