User Manual

Package information LIS244ALH
14/16
5 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
®
is an ST trademark.
ECOPACK
®
specifications are available at: www.st.com.
Figure 5. LGA16: mechanical data and package dimensions
Dimensions
Ref.
mm inch
Min. Typ. Max. Min. Typ. Max.
A1 1.500 1.600 0.05910.0630
A2 1.330 0.0524
A3 0.160 0.200 0.240 0.0063 0.0079 0.0094
d0.300 0.0118
D1 3.850 4.000 4.150 0.1516 0.1575 0.1634
E1 3.850 4.000 4.150 0.1516 0.1575 0.1634
L2 1.950 0.0768
M 0.100 0.0039
N1 0.650 0.0256
N2 0.9800.0386
P1 1.750 0.0689
P2 1.525 0.0600
T1 0.400 0.0157
T2 0.300 0.0118
k 0.050 0.0020
LGA16L (4x4x1.5mm)
Land Grid Array Package
Outline and
7974136D
mechanical data