Specifications

AMBE-3000™ Vocoder Chip Users Manual
Version 2.8, August, 2011
Table of Contents
1 PRODUCT INTRODUCTION ..............................................................................................1
1.1 Advances in Vocoder Design ....................................................................................................................1
1.2 AMBE-3000™ Vocoder Chip Features .....................................................................................................1
1.3 Typical Applications...................................................................................................................................2
2 HARDWARE INFORMATION.............................................................................................3
2.1 Special Handling Instructions ....................................................................................................................3
2.2 Package Details.........................................................................................................................................4
2.2.1 128-pin Low-Profile Quad Flat Pack (LQFP).................................................................................................. 4
2.2.2 179 Pin Ball Grid Array (BGA)........................................................................................................................5
2.3 Pin Assignment Layouts............................................................................................................................6
2.3.1 LQFP Package.................................................................................................................................................. 6
2.3.2 BGA Package Pins (Bottom View)....................................................................................................................7
2.4 AMBE-3000™ Vocoder Chip Markings.....................................................................................................8
2.4.1 AMBE-3000™ Vocoder Chip LQFP Markings ................................................................................................8
2.4.2 AMBE-3000™ Vocoder Chip BGA Markings...................................................................................................9
2.5 Pin Out Table...........................................................................................................................................10
2.6 Hardware Configuration Pins...................................................................................................................17
2.7 Crystal / Oscillator Usage........................................................................................................................18
2.7.1 External Clock Source ....................................................................................................................................18
2.7.2 Crystal Oscillator............................................................................................................................................19
3 ELECTRICAL CHARACTERISTICS AND REQUIREMENTS ..........................................20
3.1 Normal Operating Conditions ..................................................................................................................20
3.2 Recommended Operating Conditions .....................................................................................................20
3.3 Absolute Maximum Ratings.....................................................................................................................20
3.4 Thermal Resistance Characteristics........................................................................................................21
3.5 Power Sequencing Requirements...........................................................................................................21
3.6 Signal Transition Levels ..........................................................................................................................22
3.7 Power-Down Sequencing:.......................................................................................................................22
3.8 Low Power Modes...................................................................................................................................23
3.8.1 Run State......................................................................................................................................................... 24
3.8.2 Idle State ......................................................................................................................................................... 24
3.8.3 Standby State................................................................................................................................................... 24
3.8.4 Halt State ........................................................................................................................................................ 24
3.8.5 Power Modes .................................................................................................................................................. 24
3.8.6 Low power mode when using the UART Packet Interface..............................................................................25
3.8.7 Low Power Mode when using the McBSP Packet Interface ...........................................................................25
3.8.8 Low Power Mode when using the McBSP Codec Interface............................................................................ 25
3.8.9 Low Power Mode when using the SPI Codec Interface..................................................................................25
3.8.10 Low Power Mode when using the Parallel Packet Interface.........................................................................25
3.8.11 Additional Requirements when Low Power Mode is enabled........................................................................26
(Subject to Change) Page v
DVSI CONFIDENTIAL PROPRIETARY