User's Guide
HE863 Family Hardware User Guide
1vv0300891 Rev.5
- 2011-03-18
Reproduction forbidden without Telit Communications S.p.A’s. written authorization - All Rights
Reserved. Page 81 of 89
14.1.6. HE863 Family Solder Reflow
The following is the recommended solder reflow profile
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface.
WARNING:
HE863 Family module can accept only one reflow process.