User's Guide
HE863 Family Hardware User Guide
1vv0300891 Rev.5
- 2011-03-18
Reproduction forbidden without Telit Communications S.p.A’s. written authorization - All Rights
Reserved. Page 5 of 89
9.1. MODEM SERIAL PORT.......................................................................................................................................61
9.2. RS232
LEVEL TRANSLATION............................................................................................................................63
10. USBPORT....................................................................................................................................................65
10.1. USB
TRANSCEIVER SPECIFICATIONS (TBD)....................................................................................................65
11. AUDIOSECTION(HE863‐EUR/EUG/NAR/NAG/AUGONLY)............................................................................66
11.1. S
ELECTION MODE..............................................................................................................................................66
11.2. M
ICROPHONE CHARACTERISTICS.....................................................................................................................68
11.2.1. Input Lines (MIC1 and MIC2) Characteristics (TBD)........................................................................68
11.3. OUTPUT
LINES (SPEAKER)...........................................................................................................................68
11.3.1. Output Lines Characteristics (TBD)....................................................................................................69
12. GENERALPURPOSEI/O................................................................................................................................70
12.1. L
OGIC LEVEL SPECIFICATIONS.........................................................................................................................72
12.2. U
SING A GPIO PAD AS INPUT..........................................................................................................................72
12.3. U
SING A GPIO PAD AS OUTPUT......................................................................................................................72
12.4. U
SING THE ALARM OUTPUT GPIO6.................................................................................................................73
12.5. I
NDICATION OF NETWORK SERVICE AVAILABILITY...........................................................................................73
12.6. RTC
BYPASS OUT............................................................................................................................................74
12.7. VAUX1
POWER OUTPUT..................................................................................................................................74
13. DACANDADCSECTION............................................................................................................................... . 76
13.1. DAC
CONVERTER.............................................................................................................................................76
13.1.1. Description..............................................................................................................................................76
13.1.2. Enabling DAC.........................................................................................................................................76
13.1.3. Low Pass Filter Example......................................................................................................................77
13.2. ADC
CONVERTER.............................................................................................................................................77
13.2.1. Description..............................................................................................................................................77
13.2.2. Using ADC Converter............................................................................................................................77
14. MOUNTINGTHEHE863FAMILYONYOURBOARD........................................................................................78
14.1. G
ENERAL...........................................................................................................................................................78
14.1.1. Recommended footprint for the application.......................................................................................78
14.1.2. Suggested Inhibit Area..........................................................................................................................79
14.1.3. Stencil......................................................................................................................................................79
14.1.4. PCB Pad Design....................................................................................................................................79
14.1.5. Solder paste...........................................................................................................................................80
14.1.6. HE863 Family Solder Reflow...............................................................................................................81
14.2. DEBUG
OF THE HE863 FAMILY IN PRODUCTION...................................................................................82
15. SIMHOLDERDESIGNGUIDE.........................................................................................................................83
15.1. O
VERVIEW.........................................................................................................................................................83
15.2. SIM
INTERFACE.................................................................................................................................................84
16. ANTENNADETECTIONDESIGNGUIDE...........................................................................................................86
17. CONFORMITYASSESSMENTISSUES(TBD).....................................................................................................87
18. SAFETYRECOMMENDATIONS......................................................................................................................88