User's Guide

HE863 Family Hardware User Guide
1vv0300891 Rev.5
- 2011-03-18
Reproduction forbidden without Telit Communications S.p.A’s. written authorization - All Rights
Reserved. Page 15 of 89
4. HE863 Family Module Connections
The HE863 Family features a 189 Balls Grid Array: in the following
sections a description of the available signals and their position in
the balls layout is presented.
4.1. HE863-EUD/NAD/AUD PIN-OUT
Ball Signal I/O Function
Internal
Pull up
Type
SIM card interface
H11 SIMCLK O External SIM signal – Clock 1.8 / 3V
G12 SIMRST O External SIM signal – Reset 1.8 / 3V
F12 SIMIO I/O External SIM signal - Data I/O 1.8 / 3V
E12 SIMIN(TBD) I
External SIM signal – Presence
(active low)
1.8
H12 SIMVCC -
External SIM signal – Power
supply for the SIM
1.8 / 3V
USB SIM(RESERVED)
F11
USB_SIM_D+
(TBD)
I/O USB SIM data (+), TBD 1.8V/3.0V
G11
USB_SIM_D-
(TBD)
I/O USB SIM data (-), TBD 1.8V/3.0V
Trace
N4 TX_TRACE O Tx data for diagnostic monitor CMOS 1.8V
N3 RX_TRACE I Rx data for diagnostic monitor CMOS 1.8V
Prog. / Data + HW Flow Control
M4
C125/RING
(TBD)
O
Output for Ring indicator
signal (RI) to DTE
CMOS 1.8V
M3
C109/DCD
(TBD)
O
Output for Data set ready
signal (DSR) to DTE
CMOS 1.8V
L3
C108/DTR
(TBD)
I
Input for Data terminal ready
signal (DTR) from DTE
CMOS 1.8V
L4
C107/DSR
(TBD)
O
Output for Data set ready
signal (DSR) to DTE
CMOS 1.8V